FPC (Flexible Printed Circuit)

Flexible circuit materials
Because there are only a few elements involved construction of a substrate for flexible circuits, none of them is lacking in importance. Each element of the flex circuit construction must be able to consistently meet the demands placed upon it for the life of the product. In addition, the material must play reliably in concert with the other material elements of the flexible circuit construction to assure ease of manufacture and reliability. Following are brief descriptions of the basic elements of flex circuit construction and their functions.

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ACP ink or Ihosei ink

Ihosei (Japan) = Anisotropic Conductive Paste (ACP) is a liquid material consisting of
electroconductive particles uniformly dispersed within a highly-insulating adhesive component. A
functional material, ACP produces an anisotropic conductive film through application and drying in
the screen-printing process. It is capable of achieving all three of the following actions at a physical
junction through a heat press process for several ten seconds:
(1) forming an electric connection between electronic components.
(2) retaining insulation between adjacent electrodes
(3) bonding and fixing.

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